Electronic Assembly Solutions
Solder Paste
ALPHA Solder Paste delivers excellent print definition, & volumetric performance. Excellent first pass ICT pin test yields, & electrical performance.Available is SAC305, low silver, & low temperature alloys, with either a NC or WS flux.
Fluxes
ALPHA fluxes are specifically developed to deliver high reliability and excellent soldering performance combined with outstanding board cosmetics and pin-testability. All of our fluxes exhibits a low tendency for solder ball generation over a wide variety of solder masks during wave soldering and Selective Soldering operations.
Solder Bar
Alpha Metals' proprietary Vaculoy® alloying process is used to produce Vaculoy Solder bars. This purification process removes metallic and non-metallic impurities and included oxides for the cleanest possible bar solder available.Vaculoy exceeds the requirements established by J-STD-006 and the previous military specification QQS-571F.
Cored Solder Wire
ALPHA cored wires are available in a choice of high-purity alloys, diameters and flux percentages, with the choice of no-clean, rosin/resin free and
lead-free options. All alloys conform to ISO 9453.
The comprehensive range of ALPHA wires is designed to give excellent wettability, produce strong joints without spattering and leave minimal
non-corrosive residues with good SIR for defect-free soldering.
Preforms
ALPHA Exactalloy® solder preforms are the enabling technology that have set the surface mount industry standard for product innovation and utility. Alpha was the rst to introduce solder preforms in tape and reel packaging and provided the innovation that set the industry standard for developing theworld’s s mallest volume solder preforms – rst with the introduction of the 0402
preform and then with the 0201 preform.
Alpha HiTech Encapsulants, Underfills, SMD Adhesives, Edgebond.
The ALPHA HiTech Product Series include a wide range of epoxies, adhesives for SMD, UV and Low Temperature applications, Encapsulants for portable applications, as well as Underfills and Cornerfills for smartphone, automotive and medical applications.